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1

Droit du commerce international et sécurité alimentaire

Jourdain-Fortier, Clotilde, Loquin, Éric

Journal:

Revue internationale de droit économique

Year:

2012

Language:

french

File:

PDF, 1.09 MB

french, 2012

2

Edge Trimming Induced Defects on Direct Bonded Wafers

Inoue, Fumihiro, Jourdain, Anne, Peng, Lan, Phommahaxay, Alain, Kosemura, Daisuke, De Wolf, Ingrid, Rebibis, Kenneth June, Miller, Andy, Sleeckx, Erik, Beyne, Eric

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 2.19 MB

english, 2018

3

High temperature activation and deactivation of single-walled carbon nanotube growth investigated by in situ Raman measurements

Picher, Matthieu, Anglaret, Eric, Jourdain, Vincent

Journal:

Diamond and Related Materials

Year:

2010

Language:

english

File:

PDF, 379 KB

english, 2010

4

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Murdoch, Gayle, Miller, Andy, Rebibis, Kenneth, Guerrero, Alice, McCutcheon, Jeremy, Privett, Mark, Neidrich, Jason, Beyer, Gerald, Beyne, Eric

Year:

2013

Language:

english

File:

PDF, 1009 KB

english, 2013

5

QUANTUM MONTE CARLO SIMULATIONS OF FERMIONS: A MATHEMATICAL ANALYSIS OF THE FIXED-NODE APPROXIMATION

CANCÈS, ERIC, JOURDAIN, BENJAMIN, LELIÈVRE, TONY

Journal:

Mathematical Models and Methods in Applied Sciences

Year:

2006

Language:

english

File:

PDF, 472 KB

english, 2006

6

Edge trimming for surface activated dielectric bonded wafers

Inoue, Fumihiro, Jourdain, Anne, Visker, Jakob, Peng, Lan, Moeller, Berthold, Yokoyama, Kaori, Phommahaxay, Alain, Rebibis, Kenneth June, Miller, Andy, Beyne, Eric, Sleeckx, Erik

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.35 MB

english, 2017

7

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Development of multi-stack dielectric wafer bonding

Peng, Lan, Kim, Soon-Wook, Inoue, Fumihiro, Wang, Teng, Phommahaxay, Alain, Verdonck, Patrick, Jourdain, Anne, De Vos, Joeri, Sleeckx, Erik, Struyf, Herbert, Miller, Andy, Beyer, Gerald, Beyne, Eric,

Year:

2016

Language:

english

File:

PDF, 960 KB

english, 2016

8

Anomalous ${C}$ – ${V}$ Inversion in TSVs: The Problem and Its Cure

Stucchi, Michele, De Vos, Joeri, Jourdain, Anne, Li, Yunlong, Van Der Plas, Geert, Croes, Kristof, Beyne, Eric

Journal:

IEEE Transactions on Electron Devices

Year:

2018

Language:

english

File:

PDF, 2.30 MB

english, 2018

9

Etch process modules development and integration in 3D SOC applications

Tutunjyan, Nina, Sardo, Stefano, De Vos, Joeri, Van Huylenbroeck, Stefaan, Jourdain, Anne, Peng, Lan, Inoue, Fumihiro, Rassoul, Nouredine, Beyer, Gerald, Beyne, Eric, Miller, Andy, Piumi, Daniele

Journal:

Microelectronic Engineering

Year:

2018

Language:

english

File:

PDF, 1.35 MB

english, 2018

10

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications

Jourdain, Anne, De Vos, Joeri, Rassoul, Nouredine, Zahedmanesh, Houman, Miller, Andy, Beyer, Gerald, Beyne, Eric, Walsby, Edward, Patel, Jash, Ansell, Oliver, Ashraf, Huma, Thomas, Dave, Li, Shifang,

Year:

2018

Language:

english

File:

PDF, 1.25 MB

english, 2018

11

Rheological Properties of Covalent Adaptable Networks with 1,2,3-Triazolium Cross-Links: The Missing Link between Vitrimers and Dissociative Networks

Jourdain, Antoine, Asbai, Rawnaq, Anaya, Omaima, Chehimi, Mohamed M., Drockenmuller, Eric, Montarnal, Damien

Journal:

Year:

2020

File:

PDF, 6.39 MB

2020

12

Effect of deformation on knitted glass preform in-plane permeability

Gilles Dusserre, Eric Jourdain, Gérard Bernhart

Journal:

Polymer Composites

Year:

2011

Language:

english

File:

PDF, 1.33 MB

english, 2011

13

On adaptive stratification

Pierre Etore, Gersende Fort, Benjamin Jourdain, Eric Moulines

Journal:

Annals of Operations Research

Year:

2011

Language:

english

File:

PDF, 1009 KB

english, 2011

14

Influence of the growth conditions on the defect density of single-walled carbon nanotubes

Matthieu Picher, Hugo Navas, Raul Arenal, Etienne Quesnel, Eric Anglaret, Vincent Jourdain

Journal:

Year:

2012

Language:

english

File:

PDF, 981 KB

english, 2012

15

Stability of emulsions containing sodium caseinate and dextran sulfate: Relationship to complexation in solution

Laureline Jourdain, Martin E. Leser, Christophe Schmitt, Martin Michel, Eric Dickinson

Journal:

Food Hydrocolloids

Year:

2008

Language:

english

File:

PDF, 465 KB

english, 2008

16

Self-Deactivation of Single-Walled Carbon Nanotube Growth Studied by in Situ Raman Measurements

Picher, Matthieu, Anglaret, Eric, Arenal, Raul, Jourdain, Vincent

Journal:

Year:

2009

Language:

english

File:

PDF, 1.02 MB

english, 2009

17

Processes Controlling the Diameter Distribution of Single-Walled Carbon Nanotubes during Catalytic Chemical Vapor Deposition

Picher, Matthieu, Anglaret, Eric, Arenal, Raul, Jourdain, Vincent

Journal:

Year:

2011

Language:

english

File:

PDF, 3.36 MB

english, 2011

18

SPIE Proceedings [SPIE SPIE Astronomical Telescopes + Instrumentation - Amsterdam, Netherlands (Sunday 1 July 2012)] Modern Technologies in Space- and Ground-based Telescopes and Instrumentation II - Fast figuring of large optics by reactive atom plasma

Castelli, Marco, Navarro, Ramón, Cunningham, Colin R., Jourdain, Renaud, Morantz, Paul, Prieto, Eric, Shore, Paul

Year:

2012

Language:

english

File:

PDF, 816 KB

english, 2012

19

Mixed Layers of Sodium Caseinate + Dextran Sulfate: Influence of Order of Addition to Oil−Water Interface

Jourdain, Laureline S., Schmitt, Christophe, Leser, Martin E., Murray, Brent S., Dickinson, Eric

Journal:

Year:

2009

Language:

english

File:

PDF, 2.70 MB

english, 2009

20

Interplay of interfacial compounds, catalyst thickness and carbon precursor supply in the selectivity of single-walled carbon nanotube growth

Navas, Hugo, Maruyama, Benji, Weaver, Kent, Paillet, Matthieu, Zahab, Ahmed-Azmi, Fossard, Frédéric, Loiseau, Annick, Quesnel, Etienne, Anglaret, Eric, Jourdain, Vincent

Journal:

Year:

2014

Language:

english

File:

PDF, 3.06 MB

english, 2014

21

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Electrically yielding Collective Hybrid Bonding for 3D stacking of ICs

Jourdain, Anne, Soussan, Philippe, Swinnen, Bart, Beyne, Eric

Year:

2009

Language:

english

File:

PDF, 551 KB

english, 2009

22

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Temporary bonding for High-topography Applications: Spin-on Material Versus Dry Film

Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Guerrero, Alice, Bailey, Susan, Privett, Mark, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

Year:

2014

Language:

english

File:

PDF, 2.95 MB

english, 2014

23

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Thermal mismatch induced reliability issues for Cu filled through-silicon vias

De Messemaeker, Joke, Croes, Kristof, Vandevelde, Bart, Velenis, Dimitrios, Redolfi, Augusto, Jourdain, Anne, Beyer, Gerald, Swinnen, Bart, Beyne, Eric, DeWolf, Ingrid

Year:

2012

Language:

english

File:

PDF, 988 KB

english, 2012

24

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's

Halder, Sandip, Jourdain, Anne, Claes, Martine, de Wolf, Ingrid, Travaly, Youssef, Beyne, Eric, Swinnen, Bart, Pepper, Valery, Guittet, Pierre-Yves, Savage, Greg, Markwort, Lars

Year:

2011

Language:

english

File:

PDF, 831 KB

english, 2011

25

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications

Jourdain, Anne, Buisson, Thibault, Phommahaxay, Alain, Redolfi, Augusto, Thangaraju, Sarasvathi, Travaly, Youssef, Beyne, Eric, Swinnen, Bart

Year:

2011

Language:

english

File:

PDF, 1.22 MB

english, 2011

26

[IEEE 2008 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2008.12.15-2008.12.17)] 2008 IEEE International Electron Devices Meeting - Through-silicon via and die stacking technologies for microsystems-integration

Beyne, Eric, De Moor, Piet, Ruythooren, Wouter, Labie, Riet, Jourdain, Anne, Tilmans, Harrie, Tezcan, Deniz Sabuncuoglu, Soussan, Philippe, Swinnen, Bart, Cartuyvels, Rudi

Year:

2008

Language:

english

File:

PDF, 2.10 MB

english, 2008

27

Controlling the Crystalline Quality and the Purity of Single-walled Carbon Nanotubes Grown by Catalytic Chemical Vapor Deposition

Navas, Hugo, Picher, Matthieu, Arenal, Raul, Quesnel, Etienne, Anglaret, Eric, Jourdain, Vincent

Journal:

MRS Proceedings

Year:

2013

Language:

english

File:

PDF, 2.89 MB

english, 2013

28

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal

Phommahaxay, Alain, Nakamura, Atsushi, Jourdain, Anne, Verbinnen, Greet, Kamochi, Yoshitaka, Koyama, Ichiro, Iwai, Yu, Sawano, Mitsuru, Tan, Shiro, Miller, A., Beyer, Gerald, Sleeckx, E., Beyne, Eric

Year:

2015

Language:

english

File:

PDF, 1.19 MB

english, 2015

29

ADVANCEMENTS IN EPDM SPONGE COMPOUND PROCESSING USING EPDM BIMODAL POLYMERS

Jacob, Sunny, Jourdain, Eric P.

Journal:

Rubber Chemistry and Technology

Year:

2011

Language:

english

File:

PDF, 1.38 MB

english, 2011

30

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Single-release-layer process for temporary bonding applications in the 3D integration area

Jourdain, Anne, Phommahaxay, Alain, Velenis, Dimitrios, Guerrero, Alice, Bai, Dongshun, Yess, Kim, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

Year:

2015

Language:

english

File:

PDF, 1.14 MB

english, 2015

31

[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Jourdain, Anne, Buisson, Thibault, Phommahaxay, Alain, Privett, Mark, Wallace, Dan, Sood, Sumant, Bisson, Peter, Beyne, Eric, Travaly, Youssef, Swinnen, Bart

Year:

2010

Language:

english

File:

PDF, 507 KB

english, 2010

32

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows

De Vos, Joeri, Stucchi, Michele, Jourdain, Anne, Beyne, Eric, Patel, Jash, Crook, Kath, Carruthers, Mark, Hopkins, Janet, Ashraf, Huma

Year:

2015

Language:

english

File:

PDF, 673 KB

english, 2015

33

Recent Patents on In-Plane Permeability Measurement of LCM Composite Reinforcements

Gantois, Renaud, Jourdain, Eric, Dusserre, Gilles

Journal:

Recent Patents on Engineering

Year:

2009

Language:

english

File:

PDF, 226 KB

english, 2009

34

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects

Derakhshandeh, Jaber, Preter, Inge De, Gerets, Carine, Hou, Lin, Heylen, Nancy, Beyne, Eric, Beyer, Gerald, Slabbekoorn, John, Dubey, Vikas, Jourdain, Anne, Potoms, Goedele, Inoue, Fumihiro, Jamieson,

Year:

2016

Language:

english

File:

PDF, 792 KB

english, 2016

35

Enhanced Ionic Conductivity of a 1,2,3-Triazolium-Based Poly(siloxane ionic liquid) Homopolymer

Jourdain, Antoine, Serghei, Anatoli, Drockenmuller, Eric

Journal:

ACS Macro Letters

Year:

2016

Language:

english

File:

PDF, 528 KB

english, 2016

36

[IEEE 2016 IEEE International Reliability Physics Symposium (IRPS) - Pasadena, CA, USA (2016.4.17-2016.4.21)] 2016 IEEE International Reliability Physics Symposium (IRPS) - Impact of wafer thinning on front-end reliability for 3D integration

Chasin, Adrian, Scholz, Mirko, Guo, Wei, Franco, Jacopo, Potoms, Goedele, Jourdain, Anne, Linten, Dimitri, Van der Plas, Geert, Absil, Philippe, Beyne, Eric

Year:

2016

Language:

english

File:

PDF, 993 KB

english, 2016

37

Cationic and dicationic 1,2,3-triazolium-based poly(ethylene glycol ionic liquid)s

Obadia, Mona M., Jourdain, Antoine, Serghei, Anatoli, Ikeda, Taichi, Drockenmuller, Eric

Journal:

Polymer Chemistry

Year:

2017

Language:

english

File:

PDF, 860 KB

english, 2017

38

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Cost Comparison of Different TSV Implementation Options

Velenis, Dimitrios, Huylenbroeck, Stefaan Van, Heylen, Nancy, Vandersmissen, Kevin, Jourdain, Anne, Miller, Andy, Beyne, Eric

Year:

2016

Language:

english

File:

PDF, 684 KB

english, 2016

39

Mise en place d’un dispositif de transport automatisé avec sécurisation informatique de l’envoi et de la réception des produits sanguins labiles (PSL) au CHRU de Lille

Renom, Pascale, Resch, Eric, Jourdain, Merce, Nelken, Brigitte, Lesage, Serge, Gavel, Philippe, Susen, Sophie

Journal:

Transfusion Clinique et Biologique

Year:

2016

Language:

french

File:

PDF, 369 KB

french, 2016

40

Unveiling the Evolutions of Nanotube Diameter Distribution during the Growth of Single-Walled Carbon Nanotubes

Navas, Hugo, Picher, Matthieu, Andrieux-Ledier, Amandine, Fossard, Frédéric, Michel, Thierry, Kozawa, Akinari, Maruyama, Takahiro, Anglaret, Eric, Loiseau, Annick, Jourdain, Vincent

Journal:

Year:

2017

Language:

english

File:

PDF, 2.51 MB

english, 2017

41

Influence of Si wafer thinning processes on (sub)surface defects

Inoue, Fumihiro, Jourdain, Anne, Peng, Lan, Phommahaxay, Alain, De Vos, Joeri, Rebibis, Kenneth June, Miller, Andy, Sleeckx, Erik, Beyne, Eric, Uedono, Akira

Journal:

Applied Surface Science

Year:

2017

Language:

english

File:

PDF, 1.39 MB

english, 2017

42

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking

Inoue, Fumihiro, Jourdain, Anne, Vos, Joeri De, Sleeckx, Erik, Beyne, Eric, Patel, Jash, Ansell, Oliver, Ashraf, Huma, Hopkins, Janet, Thomas, Dave, Uedono, Akira

Year:

2016

Language:

english

File:

PDF, 1.70 MB

english, 2016

43

1,2,3-Triazolium-based linear ionic polyurethanes

Jourdain, Antoine, Antoniuk, Iurii, Serghei, Anatoli, Espuche, Eliane, Drockenmuller, Eric

Journal:

Polymer Chemistry

Year:

2017

Language:

english

File:

PDF, 803 KB

english, 2017

44

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Extreme wafer thinning optimization for via-last applications

Jourdain, Anne, De Vos, Joeri, Inoue, Fumihiro, Rebibis, Kenneth, Miller, Andy, Beyer, Gerald, Beyne, Eric, Walsby, Edward, Patel, Jash, Ansell, Oliver, Hopkins, Janet, Ashraf, Huma, Thomas, Dave

Year:

2016

Language:

english

File:

PDF, 977 KB

english, 2016

45

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer

Phommahaxay, Alain, Jourdain, Anne, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Bai, Dongshun, Yess, Kim, Arnold, Kim

Year:

2017

Language:

english

File:

PDF, 1.48 MB

english, 2017

46

Tuning the Viscosity Profile of Ionic Vitrimers Incorporating 1,2,3-Triazolium Cross-Links

Obadia, Mona M., Jourdain, Antoine, Cassagnau, Philippe, Montarnal, Damien, Drockenmuller, Eric

Journal:

Advanced Functional Materials

Year:

2017

Language:

english

File:

PDF, 1.41 MB

english, 2017

47

RIE dynamics for extreme wafer thinning applications

Rassoul, Nouredine, Jourdain, Anne, Tutunjyan, Nina, De Vos, Joeri, Sardo, Stefano, Inoue, Fumihiro, Piumi, Daniele, Beyer, Gerald, Miller, Andy, Beyne, Eric, Walsby, Edward, Patel, Jash, Ansel, Olive

Journal:

Microelectronic Engineering

Year:

2018

Language:

english

File:

PDF, 7.93 MB

english, 2018

48

Year-round records of bulk and size-segregated aerosol composition in central Antarctica (Concordia site) – Part 1: Fractionation of sea-salt particles

Legrand, Michel, Preunkert, Susanne, Wolff, Eric, Weller, Rolf, Jourdain, Bruno, Wagenbach, Dietmar

Journal:

Atmospheric Chemistry and Physics

Year:

2017

Language:

english

File:

PDF, 7.99 MB

english, 2017

49

Using Telehealth Technology to Deliver Pulmonary Rehabilitation to Patients with Chronic Obstructive Pulmonary Disease

Stickland, Michael K, Jourdain, Tina, Wong, Eric YL, Rodgers, Wendy M, Jendzjowsky, Nicholas G, MacDonald, G Fred

Journal:

Canadian Respiratory Journal

Year:

2011

File:

PDF, 1.22 MB

2011

50

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - "Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects

De Vos, Joeri, Van Huylenbroeck, Stefaan, Jourdain, Anne, Heylen, Nancy, Peng, Lan, Jamieson, Geraldine, Tutunjyan, Nina, Sardo, Stefano, Miller, Andy, Beyne, Eric

Year:

2018

File:

PDF, 1.24 MB

2018

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